BT carrier boards are mostly used for mobile phone MEMS chips, communication chips, memory chips and other products, and there are still some opportunities for LED chips. However, the manufacturing process of BT carrier technology is lower than that of ABF carrier. It is a mass production concept, and the capacity does not form a scale, so it is difficult to have advantages! BT carrier board, BT board, BT circuit board

ABF material is a material developed under the leadership of Intel, which is used for the production of high-level carrier boards such as flip chip. Compared with BT substrate, ABF material can be used as an IC with thin lines and high pin count and high transmission. It is mostly used for large high-end chips such as CPU, GPU and chipset. ABF is used as an additional layer material. If ABF is directly attached to the copper foil substrate, it can be used as a circuit, and there is no need for hot pressing process. In the past, ABF FC had thickness problems, but as the technology of copper foil substrate is more and more advanced, ABF FC can solve the thickness problem as long as it uses thin plates. In the early days, ABF carrier boards were mostly used in computers and game consoles. With the rise of smart phones and the change of packaging technology, the ABF industry was at a low tide. However, in recent years, new applications such as the improvement of network speed and technological breakthroughs, high-performance computing and so on have surfaced, and the demand for ABF has been amplified again. From the perspective of industry trend, ABF substrate can keep up with the pace of advanced semiconductor manufacturing process, meet the requirements of thin line, thin line width / line distance, and the future market growth potential is expected.