With the development of wind energy, solar energy, heat pump, new energy equipment, electric vehicles, rail transit and other fields, it has gradually entered a trillion market scale. Insulated gate bipolar transistor (IGBT) will be used in these fields. The rapid development of the downstream market will create a huge demand for the key material of IGBT module packaging - Ceramic copper clad laminate. With such a favorable downstream market, it is necessary to develop high-performance ceramic copper-clad substrates to meet the needs of different fields, especially to speed up the R & D and industrialization of highly reliable aluminum nitride substrates, silicon nitride substrates and copper-clad laminates.

1、 Ceramic substrate is the key basic material of IGBT

The heat generated by high-voltage and high-power IGBT modules is mainly transmitted to the shell through ceramic copper clad laminate, so ceramic copper clad laminate is an indispensable key basic material for power module packaging in the field of power electronics.

Ceramic substrate not only has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength and low expansion of ceramics, but also has the high conductivity and excellent welding performance of oxygen free copper metal, and can etch various patterns like PCB circuit board.

Ceramic copper clad laminate combines various advantages of power electronic packaging materials:

1) The ceramic part has excellent thermal conductivity and pressure resistance characteristics;

2) The copper conductor has extremely high current carrying capacity;

3) High adhesion strength and reliability between metal and ceramic;

4) It is convenient to etch patterns and form circuit substrates;

5) Excellent welding performance, suitable for aluminum wire bonding.

2、 Three major materials become mainstream

The performance of ceramic substrate material is the decisive factor of the performance of ceramic copper clad laminate. At present, there are three kinds of ceramics that have been used as substrate materials for ceramic copper clad laminates, namely, alumina ceramic substrate, aluminum nitride ceramic substrate and silicon nitride ceramic substrate.