Photolithography is the most important step in the manufacturing process of semiconductor devices. Photolithography is a process that uses a mask with graphic design to form a pattern on the substrate through photochemical reaction, exposure and development. Lithography technology is mainly used in semiconductor device processing, integrated circuit manufacturing, etc. Lithography emes, micro nano processing, lithography emes micro nano processing, lithography sub micro level OEM
The main process of photolithography: first, ultraviolet light irradiates the surface of the substrate with a layer of photoresist film through the mask, causing chemical reactions in the photoresist in the exposed area; Then dissolve and remove the photoresist in the exposed area or unexposed area through the development technology (the former is called positive photoresist, and the latter is called negative photoresist), so that the pattern on the mask is copied onto the photoresist film; Finally, the pattern is transferred to the substrate by etching technology.
Processing parameters of purple core Zixin semiconductor lithography
Machining accuracy: 1 μ m. Accuracy is within 5%
Substrate materials: silicon wafer, oxidized silicon wafer, glass, sapphire, ceramics, pi/pet flexible substrate
Substrate size: 6', 4', 2', and irregular chips